Strategy for Improvement of Non-flammability in Functional Polyimides
-
- Ishii Junichi
- Department of Chemistry, Faculty of Science, Toho University
-
- Yokotsuka Hideyuki
- Department of Chemistry, Faculty of Science, Toho University
-
- Saito Takayuki
- Department of Chemistry, Faculty of Science, Toho University
-
- Hasegawa Masatoshi
- Department of Chemistry, Faculty of Science, Toho University
Search this article
Abstract
A phosphorus (P)-containing diamine was synthesized and used as a comonomer at a minor fraction to improve insufficient non-flammability of a poly(ester imide) system as a promising candidate of base film materials in flexible printed circuit boards (FPC). The P-modified PEsI copolymer film displayed the highest level of non-flammability (UL-94, V-0) comparable to commercially available conventional aromatic PI films in addition to original excellent properties, i.e., a very high Tg, a low linear coefficient of thermal expansion (15.7 ppm/K) close to copper foils, a low water absorption (0.54 %), a low linear coefficient of humidity expansion (5.53 ppm/RH%), and sufficient toughness (elongation at break = ca. 40%). This approach was also attempted for a very flammable low-modulus PI system for aiming at an application as a coating-type cover layer material in FPC.
Journal
-
- Journal of Photopolymer Science and Technology
-
Journal of Photopolymer Science and Technology 24 (3), 287-291, 2011
The Society of Photopolymer Science and Technology(SPST)
- Tweet
Keywords
Details 詳細情報について
-
- CRID
- 1390282679301285632
-
- NII Article ID
- 130004464891
- 40019008756
-
- NII Book ID
- AA11576862
-
- ISSN
- 13496336
- 09149244
-
- NDL BIB ID
- 11254521
-
- Text Lang
- en
-
- Data Source
-
- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
-
- Abstract License Flag
- Disallowed