Strategy for Improvement of Non-flammability in Functional Polyimides
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- Ishii Junichi
- Department of Chemistry, Faculty of Science, Toho University
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- Yokotsuka Hideyuki
- Department of Chemistry, Faculty of Science, Toho University
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- Saito Takayuki
- Department of Chemistry, Faculty of Science, Toho University
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- Hasegawa Masatoshi
- Department of Chemistry, Faculty of Science, Toho University
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抄録
A phosphorus (P)-containing diamine was synthesized and used as a comonomer at a minor fraction to improve insufficient non-flammability of a poly(ester imide) system as a promising candidate of base film materials in flexible printed circuit boards (FPC). The P-modified PEsI copolymer film displayed the highest level of non-flammability (UL-94, V-0) comparable to commercially available conventional aromatic PI films in addition to original excellent properties, i.e., a very high Tg, a low linear coefficient of thermal expansion (15.7 ppm/K) close to copper foils, a low water absorption (0.54 %), a low linear coefficient of humidity expansion (5.53 ppm/RH%), and sufficient toughness (elongation at break = ca. 40%). This approach was also attempted for a very flammable low-modulus PI system for aiming at an application as a coating-type cover layer material in FPC.
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 24 (3), 287-291, 2011
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詳細情報 詳細情報について
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- CRID
- 1390282679301285632
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- NII論文ID
- 130004464891
- 40019008756
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- NII書誌ID
- AA11576862
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- ISSN
- 13496336
- 09149244
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- NDL書誌ID
- 11254521
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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- KAKEN
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- 使用不可