Effect of platen surface texture in sapphire-mechanical polishing

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Other Title
  • サファイア基板のメカニカルポリシングに及ぼす定盤表面性状の影響
  • サファイア基板のメカニカルポリシングに及ぼす定盤表面性状の影響 : 定盤表面性状とスラリーフロー並びに研磨レートの関係
  • サファイア キバン ノ メカニカルポリシング ニ オヨボス ジョウバン ヒョウメン セイジョウ ノ エイキョウ : ジョウバン ヒョウメン セイジョウ ト スラリーフロー ナラビニ ケンマ レート ノ カンケイ
  • —定盤表面性状とスラリーフロー並びに研磨レートの関係—
  • –Relationship between platen surface texture, slurry flow and removal rate–

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In mechanical polishing, a slurry of mixed free abrasive grains is applied to the contact surface between the workpiece and the platen. The mechanical polishing characteristics are affected by not only the platen materials and its surface texture, but also the slurry flow in the contact surface. Therefore, most previous studies on slurry flow focused only on qualitative evaluation based on the observed image, and there have been no previous quantitative evaluations. In this study, we discuss the effects of the surface texture of pure-Cu platen on the slurry flow and removal rate. The platen surface texture affects the slurry wettability. The slurry flow velocity is high in cases of high slurry wettability for the platen. The changes in free or fixed abrasive mechanism due to the platen surface texture greatly affect the removal rate in mechanical polishing.

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