書誌事項
- タイトル別名
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- Microstructure of Bonding Interface and Influence of Sn plate in Welding of Lead for Aluminum Electrolytic Condenser
- アルミニウム デンカイ コンデンサ ノ リードセン ヨウセツ ニ オケル セツゴウ カイメン ノ ミクロ コウゾウ ニ オヨボス Sn メッキ ノ エイキョウ
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Lead of aluminum electrolytic condenser is composed of Sn plated Fe wire (named CP wire) and pure Al wire. Those wires are welded by an arc-stud welding method. The tops of both wires are melted by arc energy and bonded by percussive pressure in this welding method. This paper deals with the microstructure of the interface of Fe/Al and the influence of Sn with the microstructure. From the results of TEM observation and LEED analysis, it was found that the intermetallic compound was formed at the interface of Fe/Al. The intermetallic compounds formed at the interface were FeAl3 and Fe2Al5. This layer thickness was less than 1.5μm. The intermetallic compounds were produced by the diffusion Fe to Al side. The intermetallic compound were not contained Sn. Sn remained at the melting area of Fe wire as the intermetallic compound with Cu. Sn was not diffuse into Al side. In case of using Sn-less Fe wire, the microstructure of the interface of Fe/Al was equivalent to that of Sn plated Fe wire. It was considered that the microstructure of the interface of Fe/Al was not influenced by Sn.
収録刊行物
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- 素材物性学雑誌
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素材物性学雑誌 23 (1), 13-18, 2010
日本素材物性学会
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390282679320615808
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- NII論文ID
- 110007595573
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- NII書誌ID
- AN10140273
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- COI
- 1:CAS:528:DC%2BC3cXhsVWrtLbI
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- ISSN
- 18846610
- 09199853
- http://id.crossref.org/issn/09199853
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- NDL書誌ID
- 10752980
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可