-
- 平野 栄樹
- Graduate school of Engineering, Tohoku University
-
- Rasly Mahmoud
- Graduate school of Engineering, Tohoku University
-
- Kaushik Neelam
- WPI-AIMR, Tohoku University
-
- 江刺 正喜
- WPI-AIMR, Tohoku University
-
- 田中 秀治
- Graduate school of Engineering, Tohoku University
書誌事項
- タイトル別名
-
- Particle Removal without Causing Damage to MEMS Structure
- MEMS コウゾウ ニ ソンショウ オ アタエナイ パーティクル ジョキョ ホウホウ
この論文をさがす
抄録
Particulate contamination on a wafer is the most crucial problem for wafer bonding, which is one of key process technologies for MEMS (Micro Electro Mechanical Systems). To address the problem, physical assists such as megasonic agitation is generally employed, but acoustic agitation often causes damage to fragile MEMS structures. In this study, several cleaning methods were compared in terms of both particle removal efficiency (PRE) and damage to the fragile MEMS structures. Conventional immersion type cleaning or ultrasonic cleaning cannot remove small particles efficiently, while atomized water jet spray (2-fluid jet spray) cleaning with pressurized nitrogen gas can effectively remove particles without damage to cantilever structures in a short time. Megasonic cleaning with de-ionized water can remove the particles, but it damages the cantilever structures at a same time. In contrast, megasonic cleaning with surfactant dissolved water or diluted ammonia/H2O2 water can effectively remove particles even at a low physical energy, which causes no damage to the structures.
収録刊行物
-
- 電気学会論文誌E(センサ・マイクロマシン部門誌)
-
電気学会論文誌E(センサ・マイクロマシン部門誌) 133 (5), 157-163, 2013
一般社団法人 電気学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390282679437798784
-
- NII論文ID
- 10031167012
-
- NII書誌ID
- AN1052634X
-
- ISSN
- 13475525
- 13418939
-
- NDL書誌ID
- 024671192
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可