Micro Connector for High Packaging Density Fabricated by Using UV Thick Photoresist

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Abstract

A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold for Ni electroforming. The tips of the plug terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make firm contact of the micro connector, a two-step guidance was adopted. The size of the terminal of the fabricated micro connector was 50 μm-thickness and 15 μm-width (minimum). The maximum aspect ratio of the fabricated micro connector was 3.3 and the terminal pitch 80 μm. A contact resistance of 50 mΩ, a contact force of 2.08 mN, Young’s modulus of 80 GPa and a permissible current were obtained for practical use for the micro connector.

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