書誌事項
- タイトル別名
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- Ultra-Fine Pitch Electrical feed through using Si deep etching and bonding wafer
- Si ビサイ カコウ オヨビ ハリアワセ ギジュツ オ リヨウ シタ チョウビサイ ピッチ ハイセン ギジュツ
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Si based multi-layered print circuit board is developed. The Si wafer, which has the same thermal coefficient as mounted chips, of 4 inch size was used and we have fabricated the electrical feed through by filling the metal into the small holes prepared by ICP etching. Moreover the wafers with through holes and trenches were aligned and bonded to make the stacked layer structure and we had tried the metal filling into the holes and trenches. The fabricated device was tested by insulation measurement. As a result, insulating layer of more than 1GΩ was obtained.
収録刊行物
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- 電気学会論文誌E(センサ・マイクロマシン部門誌)
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電気学会論文誌E(センサ・マイクロマシン部門誌) 122 (8), 409-414, 2002
一般社団法人 電気学会
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詳細情報 詳細情報について
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- CRID
- 1390282679438635904
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- NII論文ID
- 130005403988
- 10009583395
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- NII書誌ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
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- NDL書誌ID
- 6244599
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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