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- MORITA Yasuyuki
- Graduate School of Engineering Sciences, Kyushu University
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- ARAKAWA Kazuo
- Research Institute for Applied Mechanics, Kyushu University
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- TODO Mitsugu
- Research Institute for Applied Mechanics, Kyushu University
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- KANETO Masayuki
- Nitto Denko Corporation
Bibliographic Information
- Other Title
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- モアレ干渉法を応用したフリップチップデバイスの熱変形解析
Abstract
Moiré interferometry technique was adopted to analyze thermal deformations of four kinds of flip-chip devices mounted on FR-4 substrate and multi-layer substrate, with and without underfill. A thermal loading was applied by heating the devices from room temperature 25°C to an elevated temperature 100°C. The experimental results showed that the underfill gave similar curvatures of silicon chip and the substrate. In the flip-chip devices mounted on the multi-layer substrate, thermal expansion coefficient mismatch between the chip and substrate was reduced, and bending deformations were decreased. The deformation of solder balls in the underfilled flip-chip device mounted on the multi-layer substrate was the least in the four kinds of flip-chip devices.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 5 (7), 654-659, 2002
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390282679536325632
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- NII Article ID
- 130004166003
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- ISSN
- 1884121X
- 13439677
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed