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- YAGUCHI Akihiro
- Mechanical Engineering Research Laboratory, Hitachi, Ltd.
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- NAKAMURA Masato
- Production Engineering Research Laboratory, Hitachi, Ltd.
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- ISHIKAWA Takashi
- Casio Hitachi Mobile Communications Co., Ltd.
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- KUROSAWA Kazuhito
- Casio Hitachi Mobile Communications Co., Ltd.
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- KIMOTO Ryosuke
- Production and Technology Unit, Renesas Technology Corp.
Bibliographic Information
- Other Title
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- 携帯機器用アンダーフィル実装試験片の強度評価
Abstract
The purpose of this study is development of a mounting structure to improve the strength of solder joints for portable devices. In this paper, the strengths of solder joints in chip-scale packages reinforced with various under-fill resins were determined by static-bending, cyclic-bending, impactbending, and heat-cycle tests. Joint strength during static, cyclic, and impact-bending was improved by reinforcing with resins. The lifetimes in heat-cycle tests (-40°C/85°C) were increased 1000 times or more. It was found that the shape of the resin fillets and the elastic modulus of the resin must be optimized to further increase the strength.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 7 (7), 613-621, 2004
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390282679536562816
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- NII Article ID
- 130004166143
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- ISSN
- 1884121X
- 13439677
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed