Development and the Application of Sn-Zn-Al Lead Free Solder
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- HOMMA Hitoshi
- Assembly Technology Group, Corporate Technology Engineering Center, Corporate Product Technology Unit, Fujitsu Limited
Bibliographic Information
- Other Title
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- 環境対応接合技術 Sn‐Zn‐Al鉛フリーはんだの開発と適用について
- Sn Zn Al ナマリ フリー ハンダ ノ カイハツ ト テキヨウ ニ ツイテ
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Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 8 (5), 404-409, 2005
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390282679536628864
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- NII Article ID
- 110001523425
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 7441184
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles