Evaluation of Peel Strength of Lead-Free Solder Joints for Reflow-Flow Soldering

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  • リフロー・フロー混載実装における鉛フリーはんだ接合部のはく離強度評価

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In order to understand how to prevent lead-free solder joints from failure caused by re-melting during reflow-flow soldering, peel strength tests for QFP solder joints were carried out at elevated temperatures and the failure conditions were investigated based on thermal and stress analysis. The proposed testing method produced the re-melting phenomenon in lead-free solder. The temperature dependence of peel strength for solder joints was clarified from the maximum shear oriented testing force. The temperature distribution and the deformation of PCBs were estimated on the basis of the thermal and stress analysis. Shear oriented forces at solder joints calculated from numerical analysis results were compared with the peeling strength obtained from the proposed tests. In the present study, the estimated failure conditions showed a good agreement with the occurrence of re-melting failure of QFP solder joints in actual soldering processes.

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