Electrical Testing of Open Defects between IEEE1149.1 Compliant ICs
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- Hashizume Masaki
- Institute of Technology and Science, The University of Tokushima
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- Kato Kenji
- Institute of Technology and Science, The University of Tokushima
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- Yotsuyanagi Hiroyuki
- Institute of Technology and Science, The University of Tokushima
Bibliographic Information
- Other Title
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- 次世代基板実装を支える検査技術 ＩＥＥＥ１１４９．１準拠ＩＣ間断線の電気検査法
- IEEE1149.1準拠IC間断線の電気検査法
- IEEE1149 1 ジュンキョ IC カンダンセン ノ デンキ ケンサホウ
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Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 14 (2), 99-102, 2011
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390282679537197440
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- NII Article ID
- 10028107475
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 11031141
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
