書誌事項
- タイトル別名
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- Formation of the Porous Film by Electroless Copper Plating.
- ムデンカイ ドウメッキ ニ ヨル ポーラスジョウ ヒマク ノ ケイセイ
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説明
Electroless copper (Cu-Ni-P) plating using polyacetylene glycol as a surfactant was applied to copper inner-layer foil treatment process. The deposited films having a flat surface with numerous pores reaching to the bottom can be obtained by this process. Bond strength between this film and FR-4 was 1.2 kgflcm, BT-800 was 0.7 kgf/cm, PPE-S2100 was 0.2 kgf/cm. For BT-800 and PPE-S2100, the bond strength of the porous film was much higher than that of the black oxide film. No damage to the crystal structure of the film was observed even after the bond strength test. And delaminations or blisterings were not observed even after the thermal shock test. Accordingly, the porous films preparing by this process can be applied for a copper inner-layer foil treatment.
収録刊行物
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- エレクトロニクス実装学会誌
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エレクトロニクス実装学会誌 1 (1), 66-69, 1998
一般社団法人エレクトロニクス実装学会
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詳細情報 詳細情報について
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- CRID
- 1390282679537902848
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- NII論文ID
- 110001238024
- 130004165499
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- NII書誌ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL書誌ID
- 4541755
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDLサーチ
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- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可
