Evaluation of the Microstructures of CSP Microjoints with Sn-Ag Lead-Free Solders.

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  • Ｓｎ‐Ａｇ系Ｐｂフリーはんだを用いたマイクロ接合部の熱疲労組織
  • Sn Agケイ Pb フリー ハンダ オ モチイタ マイクロ セツゴウブ ノ ネツ ヒロウ ソシキ

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The thermal cycle test was performed to CSP microjoints with several Sn-Ag lead-free solders, and the microstructure observation was performed before and after thermal cycle test. In the initial solder joints with Sn-3.5Ag or Sn-3.5Ag-0.76Cu, fine Ag3Sn grains were mainly distributed at the grain boundary of Sn and around there. Those grains formed the network structure in the Sn matrix. After thermal cycle test, a spherical growth of Ag3Sn grain was observed and the network structure was disappeared. In that microstructure, the crack growth was relative fast. On the other hand, as for Sn-Ag-Bi-Cu alloy, Bi phases were finely existed in Sn matrix and those were stable even after the thermal cycle test. The crack growth in Sn-Ag-Bi-Cu solder was relative slow because of the stable microstructure.

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