ポリイミド樹脂の表面改質および熱圧着を利用する銅のＤｉｒｅｃｔ　Ｍｅｔａｌｌｉｚａｔｉｏｎ

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  • Direct Metallization of Copper Using Surface Modification and Thermocompression of Polyimide Resin.
  • ポリイミド ジュシ ノ ヒョウメン カイシツ オヨビ ネツ アッチャク オ リヨウ スル ドウ ノ Direct Metallization

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A novel method is presented for the direct metallization of copper on a semi-cured polyimide resin substrates by the process of carboxylation of the resin surface, adsorption and reduction of copper ( II ) ions followed by thermocompression bonding. The potassium hydroxide treatment on polyimide resin lead to cleavage of imide ring to form the carboxyl group onto the resin surface, being responsible for the adsorption of copper ( II ) ions. The conductivity of the copper thin film formed by the reduction process was over 1.6×10-2S/_??_ which was suitable for subsequent copper electroplating. The peel strength between polyimide film and copper film was reached to be 1.l0kN/m by thermocompression at 300°C under a pressure of 24.5MPa.

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