Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy from Methanesulfonate Bath for Pb-Free Soldering.

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  • 鉛フリーはんだ接合を目的としたメタンスルホン酸浴からのＳｎ‐０．７Ｃｕ‐０．３Ａｇ３元合金の電析

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Electrodeposited Sn-Cu-Ag ternary alloy is a promising candidate to replace Sn-Pb solder coatings and provide superior thermal fatigue resistance. The ternary alloy film (Sn-0.7Cu-0.3Ag, mass%) of the desired constituent was deposited at 0.5-5A/dm2 in a methanesulfonate bath using the additives toris-3-hydroxypropyl phosphin (T3HPP), polyoxyethylene-a-naphthol (POEN) and 2, 2, -dithiodianiline (DTDA) . The addition of T3HPP markedly improved the bath stability. The ternary alloy film consists of β-Sn, Cu6Sn5 and Ag3Sn phases, and its solidus temperature was about 225°C. Whisker were not observed on the ternary alloy film of the copper substrate after six months of aging at room temperature.

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