書誌事項
- タイトル別名
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- Optimization of Heat Cycle Test Time of Pb-Free Solder by Thermal Fatigue Simulation
- ネツ ヒロウ シミュレーション ニ ヨル ナマリ フリー ハンダ ヒートサイクル シケン キカン ノ テキセイカ
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抄録
Recently, several Pb free solder are introduced on the electric appliance rapidly. But, for the co-existing of enough quality and short development L/T on the electric appliance, it become doubtful whether the existing reliability standard of heat cycle test based on the Sn-Pb solder can be used or not. Therefore, in this paper, in order to reconsider the existing standard, thermal fatigue simulation of Pb free solder with Anand model was carried out and the necessary and minimum heat cycle time for Pb free solder was calculated. In addition to that, the acceleration factors for several solders are compared. As a result of that, it became clear that the necessary and minimum heat cycle time for Pb free solder could be shortened than that of Sn-Pb solder and that the existing reliability standard based on Sn-Pb should be changed.
収録刊行物
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- エレクトロニクス実装学会誌
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エレクトロニクス実装学会誌 7 (1), 76-81, 2004
一般社団法人エレクトロニクス実装学会
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390282679538512000
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- NII論文ID
- 130004166075
- 110001235330
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- NII書誌ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL書誌ID
- 6814194
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可