Investigation on Cu wire stitch bonding. (Report 2). Influence of wire deformation behavior on bondability.

DOI 1 Citations

Bibliographic Information

Other Title
  • 銅ワイヤステッチボンディングの接合性に関する研究　（第２報）　ワイヤ変形挙動と接合性の関係
  • Investigation on Cu wire stitch bonding (Report 2)
  • 銅ワイヤステッチボンディングの接合性に関する研究(第2報)

Abstract

For the direct bonding between Cu wire and Cu alloy lead frame, the wire deformation behavior and the temperature rise at the interface between a wire and a lead terminal are very significant. In this report, the operation of the load on the bondability and the correlation between the wire deformation behavior and bondability are clarified. The wire deformation is controlled by load control, and the plastic flow and the temperature rise at the interface are depended by the equilibrium of the load and the ultrasonic vibration. By setting the higher value of the initial load, the working load can be settled the smaller value, and so the wire deformation becomes smaller and bondability is superior than that in bonding by applying the constant load.

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Details 詳細情報について

  • CRID
    1390282679699620096
  • NII Article ID
    130003764503
  • DOI
    10.2207/qjjws.14.174
  • COI
    1:CAS:528:DyaK28Xit1Kntbk%3D
  • ISSN
    24348252
    02884771
    http://id.crossref.org/issn/02884771
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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