Stress Measurement of Single Crystal Using X-ray Diffraction Technique

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  • Ｘ線回折法による単結晶応力測定
  • Xセン カイセツホウ ニ ヨル タンケッショウ オウリョク ソクテイ

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It is very important to know the residual stress states in a single crystal since the residual stresses affects the mechanical properties or functionality of some devices such as semiconductors or micromachines. X-ray diffraction technique is non destructive and detached method to know the residual stresses of crystalline materials in various atmospheres. Using a position sensitive proportional counter (PSPC) as an X-ray detector, it is very easy to obtain the reasonable diffraction profile of single crystal. In the case of using PSPC, crystal oscillation is required to obtain a perfect diffraction profile. In this paper, we explained the stress measurement technique for single crystal by using PSPC and the principle for stress measurement of single crystal with unknown stress-free lattice parameter.

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