Development of Low Damage Sputter-Deposition Method for the Preparation of Organic Light Emitting Diode

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  • HOSHI Yoichi
    Faculty of Engineering, Tokyo Polytechnic University
  • KOBAYASHI Shin-ichi
    Faculty of Engineering, Tokyo Polytechnic University
  • UCHIDA Takayuki
    Faculty of Engineering, Tokyo Polytechnic University
  • SAWADA Yutaka
    Faculty of Engineering, Tokyo Polytechnic University
  • LEI Hao
    Department of Surface Engineering of Materials, Institute of Metal Research, Chinese Academy of Sciences

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  • 有機 EL 素子作製のための低ダメージスパッタ堆積法の開発
  • ユウキ EL ソシ サクセイ ノ タメ ノ テイダメージスパッタ タイセキホウ ノ カイハツ

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Abstract

 Deposition of top Al electrode films by a low damage Facing-Target sputtering method (FTS) have been attempted to fabricate an Organic Light Emitting Diode (OLED) (glass substrate/ITO /NPB/Alq3/BCP/LiF/Al). Suppression of the high energy secondary electron incidence to the substrate during the sputter-deposition of the aluminum electrode films was effective to reduce the light emitting voltage and improve the luminance efficiency of the OLED. In addition, optimization of sputtering gas pressure and reduction of the sputtering current was necessary in the deposition the electrode films to obtain the OLED with good performance. Compared with the OLED fabricated by vacuum evaporation, the OLED fabricated by our low damage sputtering system at the optimum conditions showed better injection current-luminance efficiency, although it had a little bit larger operating voltage.<br>

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