Microstructure Formation on Polytetrafluoroethylene (PTFE) and Perfluoroalkoxy (PFA) Bulk Plates by a Magnetron Enhanced Reactive Ion Etching System

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  • NABESAWA Hirofumi
    Machinery & Electronics Research Institute, Toyama Industrial Technology Center
  • HITOBO Takeshi
    Tateyama Machine Co., Ltd.
  • ASAJI Toyohisa
    Department of Mechanical Engineering, National Institute of Technology, Toyama College
  • ABE Takashi
    Department of Mechanical and Production Engineering, Graduate School of Science and Technology, Niigata University
  • SEKI Minoru
    Department of Applied Chemistry and Biotechnology, Graduate School of Engineering, Chiba University

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Abstract

　The etching characteristics of polytetrafluoroethylene (PTFE) and perfluoroalkoxy (PFA) bulk plates were studied in a magnetron enhanced reactive ion etching (M-RIE) system. The etch rates of the plates for oxygen plasma were investigated under the pressure range 0.1-2.0 Pa, and were found to strongly correlate with the self-bias voltage. The plates presented smooth surface in the 0.1-1.0 Pa pressure range, and rough surfaces at 1.5 Pa and 2.0 Pa. The roughness was introduced by a micromask sputtered from the chamber material. The titanium etching mask exhibited lower etch rates for oxygen plasma than aluminum and silicon dioxide. Finally, using the dry-etched titanium mask in low-pressure oxygen plasma, we fabricated a 5-μm pitch line-and-space structure on a PTFE plate and a 4-μm square pillar array on a PFA plate.<br>

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