New Chip Joint Method for Silicon Die Bonding

DOI Web Site Web Site 32 References
  • MIZUNO Jun
    Institute for Nanoscience and Nanotechnology, Waseda University
  • SAKUMA Katsuyuki
    Microelectronics Division, IBM Corporation
  • UNAMI Naoko
    Department of nano-science and nano-engineering, Waseda University
  • NIMURA Masatsugu
    Department of nano-science and nano-engineering, Waseda University
  • SHOJI Syuichi
    Department of nano-science and nano-engineering, Waseda University

Bibliographic Information

Other Title
  • シリコンチップの新接合技術
  • シリコンチップ ノ シン セツゴウ ギジュツ

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Journal

  • Journal of Smart Processing

    Journal of Smart Processing 1 (3), 120-125, 2012-05-20

    Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

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