Development of reparable underfill resin for flip chip interconnection

DOI

Bibliographic Information

Other Title
  • フリップチップ実装におけるリペア可能封止樹脂の開発

Abstract

When defective chips are found in increasingly expensive, high-density PWBs (printed wiring boards), it has become ever more economically important to be able to replace those chips and reuse the boards. This task is made extremely difficult, however, by the difficulty of removing the sealing adhesive that is used between chips and PWBs as protection against dust, moisture, and heat-shock. This study is intended to determine what existing adhesives might be more amenable to removal even after they have been cured and to report the development summary of such products.

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Keywords

Details 詳細情報について

  • CRID
    1390282680531896960
  • NII Article ID
    130006954885
  • DOI
    10.11486/ejisso.17.0.109.0
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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