Effect of Conditioning Process on Polishing Pad Surface Texture

DOI

Bibliographic Information

Other Title
  • ポリシングパッド表面の微視的・巨視的性状に及ぼすコンディショニングの効果
  • In-plane Micro-Deformation Distribution Characteristics of Pad Surface Texture and Contact Conditions among Pad Groove
  • パッド表面の微小面内変位特性と溝近傍におけるコンタクト解析

Abstract

In the CMP, the polishing pad surface characteristics are very important for planarization process of wafer. However, no effective quantitative evaluation methods for pad surface texture have been established. The objective of this study is to investigate the effect of conditioning process on pad surface texture. In this paper, we discuss two experiments for IC1000 pad; (I) The in-plane micro-deformation distribution characteristics of pad surface texture using the digital image correlation (DIC) method, and (II) the contact conditions among pad groove using image contact analysis. As a result, the following points were observed. (1) The DIC method can measure the in-plane micro-deformation distribution characteristics of the IC1000 pad. (2) It is important to evaluate the pad surface texture among the groove side by the conditioning process using the contact image analysis.

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Keywords

Details 詳細情報について

  • CRID
    1390282680630781312
  • NII Article ID
    130005031458
  • DOI
    10.11522/pscjspe.2012s.0.821.0
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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