グリーンデバイス用結晶基板の加工プロセス技術の研究

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書誌事項

タイトル別名
  • Study of the polishing process technology of the crystal substrate for green devices
  • － SiC 基板の加工時間短縮を実現する新規プロセス開発 －
  • －Development of a new process to realize a processing time reduction of the SiC substrate－

抄録

<p>In this study, we aim to improve the productivity of the next generation semiconductor substrates (such as SiC, GaN, Diamond etc.) through reduction of process time and production cost. Thus, our purpose is to contribute to the wide-spread usage of green devices. Here, we have developed the world's first special viscoelastic dilatancy material polishing pad which is sensitive to process conditions. We also developed a high-speed / high-pressure processing machine which can achieve high efficiency polishing of hard-to-process materials. Combination use of the developed polishing pad (Dilatancy pad® : Fujibo Ehime Co., Ltd.) and the developed processing machine (SLM-140H : Fujikoshi Machinery Corp.) has made it possible to reduce the total processing time to below one fifth of conventional processing time, which is typically required in the conventional device production. This polishing process could achieve high-efficiency and high-quality simultaneously, which are trade-off relationship in the conventional process. Considering a significant reduction of the production cost is anticipated (operating cost of the processing machine, slurry consumption, etc.), we hope that this polishing process would be contributed to the productivity improvement of the next generation semiconductor devices.</p>

収録刊行物

  • 年次大会

    年次大会 2016 (0), S1630103-, 2016

    一般社団法人 日本機械学会

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