G1300201 Evaluation of Wire Bonding State by Thin AE Sensor

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  • ISHIDA Shuichi
    National Institute of Advanced Industrial Science and Technology (AIST)
  • TABARU Tatsuo
    国立研究開発法人産業技術総合研究所製造技術研究部門
  • IWASAKI Wataru
    国立研究開発法人産業技術総合研究所製造技術研究部門
  • MIYAMOTO Hiroyuki
    九州工業大学大学院生命体工学研究科

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Other Title
  • G1300201 薄型AEセンサを用いたワイヤボンディングの接合状態評価

Abstract

In this paper, an evaluation method of wire bonding state by thin AE sensor is presented. Recommended getting AE signal close to connected area, but conventional AE sensors have drawback installing in vicinity of a connecting area due to spaces or heat-resistance. The AE sensor is 1 mm thick and has greater heat-resistance than them. This make it possible to install the AE sensor to near the connecting area. And it can also get AE signal as a high S/N ratio during a bonding. As a first step, an effectiveness of the AE sensor to evaluate a connecting state is confirmed. Shift conditions from default and consider that the AE sensor of recognizing alteration with AE signal processing in order to find out data included AE signals. As evaluation approach, we used the Mahalanobis-Taguchi method which is used in quality engineering. Consider sample set in a default condition to be a unit space and confirm the similarity of test samples in shifted conditions with figuring out the Mahalanobis distances of test samples. According to variation range, Mahalanobis distance increased and the effectiveness of the AE sensor was confirmed. A relevance between Mahalanobis distance and strength evaluation by pull test was also presented.

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