OS20F050 Accurate Measurement of Temperature-Dependent Warpage of Electronic Packaging Using FLCOS-based Fringe Projection Profilometry

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  • RI Shien
    National Institute of Advanced Industrial Science & Technology
  • MURAMATSU Takashi
    Department of Nanomechanics, Graduate School of Engineering, Tohoku University
  • SAKA Masumi
    Department of Nanomechanics, Graduate School of Engineering, Tohoku University
  • TANAKA Hiroyuki
    Information and Telecommunication Material Laboratories, Sumitomo Bakelite Co., Ltd.
  • OKABE Yukihiro
    Information and Telecommunication Material Laboratories, Sumitomo Bakelite Co., Ltd.
  • SUZUKI Hiroshi
    Information and Telecommunication Material Laboratories, Sumitomo Bakelite Co., Ltd.

Description

Electronic packaging is a series of processes toward the end of the microelectronics manufacturing, where functional semiconductors and discrete elements are electronically interconnected and mechanically assembled. Out-of-plane displacement or warpage is one of the major thermomechanical reliability concerns for board-level electronic packaging. In this study, temperature-dependent warpage distribution of electronic packaging is studied using FLCOS-based fringe projection profilometry. Phase-shifting technique effectively attains high resolution and high accuracy in analyzing phase information on a projected fringe pattern. A 50 by 50 mm size flip chip - ball grid array (FC-BGA) package was measured from 25 to 225℃ at 30℃/min rate. Experimental results show that our FLCOS-based measurement system using phase-shifting technique provides powerful means of monitoring and studying warpage in electronic packaging design and manufacturing reflow processes.

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