212 Si-CMPの研磨レートに及ぼす要因分析(セッション7 機械の評価)

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  • 212 Influence Relationship Analysis of Removal Rate in Si-Chemical Mechanical Polishing

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It is well known that the removal rate decreases with the progress of pad deterioration owing to the increase of the polishing time. In particular, the pad surface asperity is important for the polishing characteristics. It is well known that the removal rate decreases with the progress of pad deterioration owing to the increase of the polishing time. In particular, the pad surface asperity is important for the polishing characteristics. Moreover, the polishing apparatus has emitted the micro-vibration and noise. Therefore, it is thought as a very important matter for a diagnosis of the machine, and the related technology to identify the polishing conditions. This paper will investigate the relationship between the vibrations of the polishing head, coefficient of friction and -the polishing characteristics in Si-chemical mechanical polishing (CMP). As a result, we found that the coefficient of friction increases with the increase of the polishing time, and the coefficient of friction decreases by the conditioning process. Moreover, the removal rate decreases with both the increase of the vibration acceleration and the increase of the coefficient of friction. Furthermore, the result of multiple correlation analysis for each evaluation parameters of pad surface asperity can predict the removal rate precisely.

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