書誌事項
- タイトル別名
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- J0601-3-2 Underfill material dependence of the local residual stress of fli-chip on area-arrayed fine bump
抄録
Local large residual stress and the local deformation appears clearly in thinned flip chip structures because of the difference in material properties such as Young's modulus and the coefficient of thermal expansion among a bump, underfill, and a silicon chip. Since such large residual stress and the local deformation deteriorate the reliability of electronic devices, the authors measured them by using piezoresistive strain sensor chips. As a result, it was found that the amplitude of the local distribution of the residual stress reached about 100 MPa and the local deformation of about 5 μm remained on the back surface of the mounted chips. The dominant factors of the local residual stress and the deformation were the coefficient of thermal expansion and Young's modulus of underfill and the bump pitch.
収録刊行物
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- 年次大会講演論文集
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年次大会講演論文集 2010.7 (0), 265-266, 2010
一般社団法人 日本機械学会
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390282681043340928
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- NII論文ID
- 110008700860
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- ISSN
- 24331325
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可