書誌事項
- タイトル別名
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- Lead-Free Solders Property and Reliability of Electronics Packaging
抄録
This paper explains the joint reliability of the electronics packaging which uses lead-free solder. The basic physical properties of the lead-free solder materials as the Sn-Ag-Cu and the Sn-Zn are investigated and compared first. And, the joint reliability of the TSOP lead-type component was examined as one of electronic components with a short fatigue life.
収録刊行物
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- 材料力学部門講演会講演論文集
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材料力学部門講演会講演論文集 2002 (0), 225-226, 2002
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390282681044013696
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- NII論文ID
- 110002488181
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- ISSN
- 24331287
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可