New Three-Dimensional Wafer Bonding Tecnology Using the Adhesive Injection Method

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  • Matsumoto Takuji
    Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
  • Satoh Masakazu
    Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
  • Sakuma Katsuyuki
    Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
  • Kurino Hiroyuki
    Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
  • Miyakawa Nobuaki
    Fuji Xerox Co., Ltd., 2274 Hongo, Ebina–shi, Kanagawa 243–04, Japan
  • Itani Hikotaro
    Mitsubishi Heavy Industries, Ltd., 6–22, Kan–on–shin–machi 4–chome, Nishi–ku, Hiroshima 733, Japan
  • Koyanagi Mitsumasa
    Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan

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タイトル別名
  • New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method.
  • New Three-Dimensional Wafer Bonding Tec

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A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory. Several key technologies for 3D LSI, such as deep trench formation for buried interconnection, wafer grinding and chemical-mechanical polishing, wafer alignment and wafer bonding using the adhesive injection method, have been developed.

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