New Three-Dimensional Wafer Bonding Tecnology Using the Adhesive Injection Method
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- Matsumoto Takuji
- Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
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- Satoh Masakazu
- Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
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- Sakuma Katsuyuki
- Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
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- Kurino Hiroyuki
- Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
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- Miyakawa Nobuaki
- Fuji Xerox Co., Ltd., 2274 Hongo, Ebina–shi, Kanagawa 243–04, Japan
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- Itani Hikotaro
- Mitsubishi Heavy Industries, Ltd., 6–22, Kan–on–shin–machi 4–chome, Nishi–ku, Hiroshima 733, Japan
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- Koyanagi Mitsumasa
- Department of Machine Intelligence and System Engineering, Tohoku University, Aramaki, Aoba–ku, Sendai 980–77, Japan
書誌事項
- タイトル別名
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- New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method.
- New Three-Dimensional Wafer Bonding Tec
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説明
A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory. Several key technologies for 3D LSI, such as deep trench formation for buried interconnection, wafer grinding and chemical-mechanical polishing, wafer alignment and wafer bonding using the adhesive injection method, have been developed.
収録刊行物
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- Japanese Journal of Applied Physics
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Japanese Journal of Applied Physics 37 (3B), 1217-1221, 1998
The Japan Society of Applied Physics
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390282681225940352
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- NII論文ID
- 210000042790
- 110003906396
- 130004524804
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- NII書誌ID
- AA10457675
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- COI
- 1:CAS:528:DyaK1cXis1Snsrg%3D
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- ISSN
- 13474065
- 00214922
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- NDL書誌ID
- 4473581
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可