書誌事項
- タイトル別名
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- Heat Transfer Enhancement Using a Pin Fin Heat Sink Filled with Metal Foams
抄録
The recent development of information technologies due to advent of a new generation of semiconductor devices has brought us serious problems associated with high heat generation density. Conventional cooling methods such as fin heat sinks with blowing fans may not be sufficient to solve such serious heat related problems. Thus, in this study, we propose a new kind of heat sink as a solution to the problems, namely, a pin fin heat sink filled with metal foams. A series of exhaustive experiments have been conducted to confirm heat transfer enhancement as results of extended surface area and fluid mixing due to the presence of metal foams. Theoretical consideration has also been made so as to elucidate such heat transfer enhancement mechanism.
収録刊行物
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- 日本機械学会論文集B編
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日本機械学会論文集B編 77 (782), 1958-1967, 2011
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390282681238327040
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- NII論文ID
- 130001433026
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- ISSN
- 18848346
- 03875016
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- データソース種別
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- JaLC
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- 抄録ライセンスフラグ
- 使用不可