Flow and heat transfer of an epoxy molding compound for low pressure transfer molding in channels.

DOI

Bibliographic Information

Other Title
  • 低圧トランスファー成形用エポキシ樹脂の管内流動と熱伝導

Description

Flow and heat transfer characteristics of an epoxy molding compound were analyzed for low pressure transfer molding in circular channels and in a semicircular channel of the EMMI spiral flow mold. A molding apparatus having transducers for detecting material pressure and plunger displacement was used for the determination of apparent mean viscosity during material flowing. For the calculation of transient temperatures of the material in each channel, equations describing unsteady heat conduction in the cross section perpendicular to the axial direction were solved numerically. In the circular channels having equivalent cross-sectional areas to those of runners used for manufacturing, viscosity was shown to decrease with time due to delayed material temperature rise. In the semicircular channel of the EMMI mold having very small cross-sectional area, minimum viscosity was observed in a few seconds from the flow start and was shown to increase during most of the flowing time due to rapid material temperature rise.

Journal

  • KOBUNSHI RONBUNSHU

    KOBUNSHI RONBUNSHU 45 (2), 97-103, 1988

    The Society of Polymer Science, Japan

Keywords

Details 詳細情報について

  • CRID
    1390282681499043328
  • NII Article ID
    130003837128
  • DOI
    10.1295/koron.45.97
  • ISSN
    18815685
    03862186
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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