R&D of 3D-IC Technology for the AI·IoT Era

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Other Title
  • AI・IoT時代に向けた三次元集積実装技術の研究開発
  • AI ・ IoT ジダイ ニ ムケタ サンジゲン シュウセキ ジッソウ ギジュツ ノ ケンキュウ カイハツ

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Abstract

<p>3D integration is one of the most important technologies for developing new-generation electronics devices. In this article, it is reported R&D of 3D integration for contributing to the AI·IoT era.</p>

Journal

  • Vacuum and Surface Science

    Vacuum and Surface Science 62 (11), 666-671, 2019-11-10

    The Japan Society of Vacuum and Surface Science

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