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Embedded device technology of PALAP process
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- Hasegawa Kenichiro
- DENSO CORPORATION
Bibliographic Information
- Other Title
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- 一括積層PALAPによる部品内蔵基板
Description
現在デンソーでは熱可塑性樹脂を用いた一括積層工法（PALAP）に於いて、チップ部品を内蔵した部品内蔵PALAP基板を実用化しております。今回は、車載製品にも適用可能なPALAP基板による部品内蔵技術を紹介します。
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 28 (0), 110-111, 2014
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390282763027004032
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- NII Article ID
- 130007429539
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles
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- Abstract License Flag
- Disallowed
