2P3-8 A Basic Study on Mode Coupling SAW Device with Face to Face Bonding(Poster Session)
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- Okitsu Hiroyuki
- Kanagawa Institute of Technology
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- Koh Keishin
- Kanagawa Institute of Technology
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- Hohkawa Kohji
- Kanagawa Institute of Technology
Bibliographic Information
- Other Title
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- 2P3-8 対面張り合わせによるモード結合SAW素子に関する基礎検討(ポスターセッション)
Journal
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- Proceedings of Symposium on Ultrasonic Electronics
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Proceedings of Symposium on Ultrasonic Electronics 30 (0), 279-280, 2009-11-18
Institute for Ultrasonic Elecronics
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Details 詳細情報について
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- CRID
- 1390282763068754816
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- NII Article ID
- 110007721700
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- ISSN
- 24331910
- 13488236
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- Text Lang
- en
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- Data Source
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- JaLC
- CiNii Articles