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- ZHANG Wenlei
- Kyoto University
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- TSUCHIYA Toshiyuki
- Kyoto University
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- NAKANO Yu
- Omron Corporation
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- KASAI Takashi
- Omron Corporation
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- YOSHIMURA Tomohiro
- Omron Corporation
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- SANO Koji
- Omron Corporation
Bibliographic Information
- Other Title
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- MEMSマイクロホンのダイアフラム用多結晶シリコン膜の引張強度評価
Abstract
<p>This paper reports a quasi-static tensile test on the polysilicon thin film served as a diaphragm in MEMS microphone. The polysilicon tensile thin film samples have dimensions of 100 μm long, 10 μm wide and 0.78 or 1 μm thick and deposited using low pressure chemical vapor deposition (LPCVD) method, which is completely same as the microphone fabrication. The average tensile strength of polysilicon was around 2.3 GPa~3.8 GPa. A good agreement was observed between the tensile strength and compressive air test.</p>
Journal
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- The Proceedings of Mechanical Engineering Congress, Japan
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The Proceedings of Mechanical Engineering Congress, Japan 2018 (0), J2230102-, 2018
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390282763115889792
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- NII Article ID
- 130007619837
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- ISSN
- 24242667
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed