Development of Dry-nano-polishing Technique using Reactive Ion Etching for Ultra Thin Titanium Wafer

DOI DOI Web Site Web Site Web Site View 1 Remaining Hide 1 Citations 4 References Open Access

Bibliographic Information

Other Title
  • 反応性イオンエッチングを用いた極薄チタンウェハのドライナノ研磨技術の開発
  • ハンノウセイ イオンエッチング オ モチイタ ゴクウス チタンウェハ ノ ドライナノ ケンマ ギジュツ ノ カイハツ
  • Development of dry‐nano‐polishing technique using reactive ion etching for ultra thin titanium wafer

Search this article

Description

<p>In this study, we developed a dry-nano-polishing technique using reactive ion etching for ultra thin titanium wafer. The surface of titanium coated with photoresist is polished by reactive ion etching using SF6/C4F8 gas. Etching speed of titanium and photoresist were adjusted to close to each other by changing temperature and ratio of SF6/C4F8 gas. By etching titanium under these conditions, the smooth surface shape of the resist was transferred to titanium. By combining with photolithography, it is possible to polish a specific part.</p>

Journal

Citations (1)*help

See more

References(4)*help

See more

Related Projects

See more

Details 詳細情報について

Report a problem

Back to top