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- Fukumoto Shinji
- Graduate School of Engineering, Osaka University
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- Nakamura Koki
- Graduate School of Engineering, Osaka University
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- Takahashi Makoto
- Joining and Welding Research Institute, Osaka University
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- Tanaka Yuto
- Graduate School of Engineering, Osaka University
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- Takahashi Shoya
- Faculty of Engineering, Osaka University
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- Matsushima Michiya
- Graduate School of Engineering, Osaka University
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説明
<p>Bonding copper in the solid state requires either a high temperature, large deformation, or high vacuum. In the present study, copper was butt-bonded using a K-shaped groove at 298 K under no bonding pressure through copper electrodeposition. The initial gap between the faying surfaces of the copper rods were gradually filled with the electrodeposition of copper from the center to the periphery. No significant defects were observed in the bond layer, and a high joint strength of approximately 240 MPa was obtained. There were three regions in the bond layer: fine columnar grain region, ultrafine grain region, and recrystallized grain region. The size of the ultrafine grains was several tens of nanometers, and the microhardness was larger than that of the base metal. As electrodeposition progressed, there were insufficient additives for electrodeposition near the center of the bond layer, and recrystallization occurred owing to self-annealing.</p>
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 63 (6), 783-788, 2022-06-01
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390292240174892928
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- NII書誌ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 032183823
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
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- 抄録ライセンスフラグ
- 使用不可