Development of Active-Ester Type Epoxy Resin Curing Agents for the Printed Wiring Boards of High-Speed Communication Devices

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  • エレクトロニクス実装材料対応の耐久性を実現した高速通信機器のプリント配線板向け活性エステル型エポキシ樹脂硬化剤の開発

Abstract

<p>In the development of epoxy materials for the printed wiring boards of high-speed communication devices, we have developed a curing agent with a low dielectric constant and low dielectric loss tangent. By developing the basic technology of the active-ester type epoxy resin curing agent announced in 1991, we have succeeded in developing a new polyfunctional oligomer type active-ester type epoxy resin curing agent which can be used as a material for electronics. Compared with the widely used phenol novolac curing system, a significantly lower dielectric constant and lower dielectric loss tangent have been achieved whilst maintaining a high glass transition temperature. It is considered that the centrally-located dicyclopentadiene skeleton exhibits an excellent low dielectric constant and low dielectric dissipation factor whilst maintaining heat resistance due to its rigidity, small molar polarisability and large molar volume.</p>

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