Micron sized Ag sinter joiningand structural design to improve joint reliability
Bibliographic Information
- Other Title
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- ミクロンサイズ銀焼結接合と接合信頼性向上ための構造設計
Journal
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- Proceedings of Microelectronics Symposium
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Proceedings of Microelectronics Symposium 32 (0), 261-264, 2022
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390297305329539968
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- ISSN
- 2434396X
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- Text Lang
- ja
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- Data Source
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- JaLC