Properties of the Crystalline Polymer Obtained by Curingthe Epoxy Resin Having an Amide Structure

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  • KAJI Masashi
    Research & Development Division, Nippon Steel Chemical & Material Co.,Ltd. Research & Development Division, Nippon Steel Chemical & Material Co.,Ltd.
  • KAI Tomomi

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  • アミド構造を有する結晶性エポキシ樹脂硬化物の物性

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<p>An epoxy resin having an amide structure（ DGBA） was synthesized and the physical properties of a cured</p><p>polymer obtained by curing with 4,4’-dihydroxydiphenyl ether（ DHDE） were evaluated. DGBA gave a crystalline</p><p>cured polymer with a melting point of 202.9℃, which was 15.5℃ higher than that of epoxy resin having</p><p>a diphenylene ether structure（ DGDE）. The Tg of the DGBA polymer in the DMA measurement was 133.2℃,</p><p>which was 37.3 ℃ higher than that of the DGDE polymer. The DGBA polymer had a significantly low thermal</p><p>expansion coefficient of 2.7×10-5℃-1, and the thermal conductivity is 0.29 W/m･K, which is 1.45 times that of</p><p>the bisphenol A type polymer.</p>

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