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The Current Status and Perspective in Testing 3D Stacked ICs
Bibliographic Information
- Other Title
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- 3次元積層集積回路の検査技術の現状と展望
- 3ジゲン セキソウ シュウセキ カイロ ノ ケンサ ギジュツ ノ ゲンジョウ ト テンボウ
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Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 23 (1), 32-36, 2020-01-01
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390565134815288448
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- NII Article ID
- 130007783443
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 030215273
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL Search
- Crossref
- CiNii Articles