Packaging Technology of Semiconductor Device
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- Ukawa Ken
- Sumitomo Bakelite
Bibliographic Information
- Other Title
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- 半導体デバイスのパッケージング技術
Journal
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- JSAP Annual Meetings Extended Abstracts
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JSAP Annual Meetings Extended Abstracts 2021.1 (0), 188-188, 2021-02-26
The Japan Society of Applied Physics
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Details 詳細情報について
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- CRID
- 1390573947549936384
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- ISSN
- 24367613
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- Text Lang
- ja
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- Data Source
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- JaLC
