Evaluation on Flip-Chip Packaging for Quantum Computers at Cryogenic Temperature

DOI

Bibliographic Information

Other Title
  • 量子コンピュータ向けフリップチップシリコンインターポーザの極低温評価

Abstract

Quantum Computers are the most promising technologies to archive more complex calculations. At the same time, much large-number qubits are required to surpasses the performance of classical supercomputers. This paper presents the packaging structure by flip-chip stacking qubit chip on a silicon interposer, which has also interface chips or circuits, for large-scale quantum computer, and the conduction characteristics and cross-sectional structure of flip-chip silicon interposer which was cooled to cryogenic temperature (20 mK ∼ 100 mK). Interface chip and silicon interposer were manufactured in 180 nm CMOS process in this work. The interposer was cooled to cryogenic temperature, and we confirmed the conduction via flip-chip stacked interface chip.

Keywords

Details 詳細情報について

Report a problem

Back to top