3P1-8 自己集合材を用いた超音波溶接FPCB/RPCB接合の機械特性(ポスターセッション)
-
- Choi Ji-Na
- Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
-
- Lee Young-Chul
- Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
-
- Jung Seung-Boo
- Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
書誌事項
- タイトル別名
-
- 3P1-8 Mechanical property of ultrasonic bonded FPCB/RPCB joint with self-assembling material(Poster Session)
この論文をさがす
説明
As the demand for thin, light and multi-functional devices increased, the ultrasonic bonding methods has spot-lighted to novel bonding method. We evaluated the mechanical property of ultrasonic bonded joints with various conditions using self-assembling material which was Sn-58Bi solder particles dispersed in epoxy resin. After bonding process, we evaluated the mechanical and electrical properties between electrodes. The peel strength of the joints was increased with increasing of bonding time, and the resistance was decreased with increasing of bonding time.
収録刊行物
-
- 超音波エレクトロニクスの基礎と応用に関するシンポジウム講演論文集
-
超音波エレクトロニクスの基礎と応用に関するシンポジウム講演論文集 34 (0), 427-428, 2013-11-20
特定非営利活動法人 超音波エレクトロニクス協会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390845713023294592
-
- NII論文ID
- 110009847183
-
- ISSN
- 24331910
- 13488236
-
- 本文言語コード
- en
-
- データソース種別
-
- JaLC
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可