原子配列の秩序性に基づく銅薄膜結晶強度評価技術の開発

  • 羅 軼凡
    東北大学大学院工学研究科ファインメカニクス専攻
  • 鈴木 研
    東北大学大学院工学研究科附属先端材料強度科学研究センター
  • 三浦 英生
    東北大学大学院工学研究科附属先端材料強度科学研究センター

書誌事項

タイトル別名
  • Development of an Evaluation Method of the Strength of a Grain in Polycrystalline Copper Thin Films Based on the Order of Atom Arrangement

抄録

<p>In this study, a highly-reliable evaluation method of the strength of a grain in polycrystalline copper thin films was developed to establish a relationship between the crystallinity and the effective strength of a grain and a grain boundary by combining EBSD (Electron Backscattered Diffraction) analysis and micro tensile test system. The crystallinity of a grain or a grain boundary was quantitatively expressed as IQ (Image Quality) value obtained from the EBSD analysis. And the strength of a grain in polycrystalline copper thin films was evaluated by using the developed micro tensile test. Finally, the obtained results indicated that the critical resolved shear stress of this microstructure significantly changed with the IQ value of the grain boundary.</p>

収録刊行物

  • 年次大会

    年次大会 2018 (0), J0610203-, 2018

    一般社団法人 日本機械学会

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