書誌事項
- タイトル別名
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- Development of an Evaluation Method of the Strength of a Grain in Polycrystalline Copper Thin Films Based on the Order of Atom Arrangement
抄録
<p>In this study, a highly-reliable evaluation method of the strength of a grain in polycrystalline copper thin films was developed to establish a relationship between the crystallinity and the effective strength of a grain and a grain boundary by combining EBSD (Electron Backscattered Diffraction) analysis and micro tensile test system. The crystallinity of a grain or a grain boundary was quantitatively expressed as IQ (Image Quality) value obtained from the EBSD analysis. And the strength of a grain in polycrystalline copper thin films was evaluated by using the developed micro tensile test. Finally, the obtained results indicated that the critical resolved shear stress of this microstructure significantly changed with the IQ value of the grain boundary.</p>
収録刊行物
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- 年次大会
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年次大会 2018 (0), J0610203-, 2018
一般社団法人 日本機械学会
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390845713069899520
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- NII論文ID
- 130007619641
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- ISSN
- 24242667
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可