Removal Mechanism of Photoresist in Alkylene Carbonates with Water and Pluronic Surfactant

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  • HANZAWA Masaki
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science
  • OOHINATA Hidekazu
    Nomura Micro Science Co., Ltd.
  • KAWANO Shin-ichi
    Nomura Micro Science Co., Ltd.
  • AKAMATSU Masaaki
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science
  • SAKAI Kenichi
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science
  • SAKAI Hideki
    Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science

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  • 炭酸アルキレンによるフォトレジストの剥離機構：水とプルロニック系界面活性剤の添加効果
  • タンサン アルキレン ニ ヨル フォトレジスト ノ ハクリ キコウ : ミズ ト プルロニックケイ カイメン カッセイザイ ノ テンカ コウカ

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Abstract

<p>The removal mechanism of a photoresist film coated on an ITO substrate was studied by means of quartz crystal microbalance with dissipation monitoring (QCM-D) technique. The removal agent used in this study was a mixture of ethylene carbonate (EC) and propylene carbonate (PC). The QCM-D measurements demonstrated that the photoresist film was completely removed as a result of rinsing by the mixed solvent. Interestingly, the addition of water into the mixed solvent resulted in the swelling of the photoresist film. However, the removal efficiency decreased significantly at high water concentrations because the mixed solvent with water became a poor solvent for the photoresist. The addition of a Pluronic surfactant (F-68) into the mixed solvent resulted in an increase in the removal efficiency at a water concentration = 50 wt%. The polymeric surfactant induces the swelling of the photoresist film as well as the dispersion of the photoresist in the mixed solvent.</p>

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