書誌事項
- タイトル別名
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- Application of Modified Strain Hardening Rule to Thermal Fatigue Strength Evaluation of Wire Bonding in Power Module
- パワーモジュール ・ ワイヤ セツゴウブ ネツ ヒロウ キョウド ヒョウカ ニ シュウセイヒズミ コウカソク ノ テキヨウ
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説明
Power modules are used for all types of electric power control and key devices for energy saving. One of the important parts for a power module is the wire-to-semiconductor chip joint. This joint is subjected to repeated temperature cycles, and repeated thermal stress acts on the joint due to the difference in coefficient of linear thermal expansion between a wire and a die material. Wire-liftoff is the thermal fatigue caused by such repeated thermal stress. In recent years, power modules are expected to be used at high temperatures of 200℃ or higher. Finite element analysis considering both creep and plastic behavior is a powerful tool for evaluating the wire-liftoff lifetime. Stress reversal occurs in a bonding wire under a repeated thermal stress condition. It is known that the modified strain hardening rule should be utilized in the transient creep analysis instead of the conventional strain hardening rule. In this paper, we performed the fund amental study on the application of the modified strain hardening rule to wire-liftoff phenomenon for an Al wire-Si die system.
収録刊行物
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- Journal of Smart Processing
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Journal of Smart Processing 9 (5), 216-223, 2020-09-10
一般社団法人 スマートプロセス学会 （旧高温学会）
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詳細情報 詳細情報について
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- CRID
- 1390848647550806016
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- NII論文ID
- 130007906004
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- NII書誌ID
- AA12553487
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- ISSN
- 21871337
- 2186702X
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- NDL書誌ID
- 030653357
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
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- 抄録ライセンスフラグ
- 使用不可