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Thermal fatigue life evaluation of CSP joints by mechanical shear fatigue testing
Bibliographic Information
- Other Title
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- 機械的せん断疲労試験によるCSP実装部の熱サイクル疲労寿命評価
Journal
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- Proceedings of Microelectronics Symposium
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Proceedings of Microelectronics Symposium 19 (0), 2A3-2-, 2009
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390850810586396160
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- NII Article ID
- 130008032247
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- ISSN
- 2434396X
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles